Flash+RAM MCP Solutions
Flash and RAM in a single package for ease of design
For systems that require flash and RAM memory, Infineon multi-chip package (MCP) solutions simplify overall system design. By integrating both memories into a single package, Infineon MCP products decrease the BOM, lower the pin count, and reduce PCB size and layer requirements. Infineon MCP solutions offer a single, space-saving package with no compromise in performance and quality.
Flash+RAM MCP Gen 2 improves on HYPERBUS™ MCP (the prior generation) with increased performance and reliability. MCP Gen 2 upgrades from HYPERFLASH™ to SEMPER™ NOR Flash, and from HYPERRAM™ 1.0 to HYPERRAM™ 2.0. MCP Gen 2 also expands chipset support with the addition of an Octal interface option.
Infineon MCPs simplify PCB complexity in two ways: 1) Combining two chips in one reduces the BOM, and 2) going from a wide Parallel DDR SDRAM interface to a shared Serial interface reduces the number of traces. The result is a smaller PCB with fewer layers.
Infineon SEMPER™ NOR Flash, HYPERFLASH™, HYPERRAM™, and MCP solutions all share a consistent pinout. This common pinout enables a single board to support a variety of memories without major redesign, and provides the flexibility to easily expand from Flash or RAM to a system that supports both.
The JEDEC xSPI standard (JESD251) was adopted in 2017 to promote compatibility and interoperability between memory, chipsets, and other devices. Infineon’s Flash+RAM MCP Gen 2 is offered in Octal (JEDEC xSPI Profile 1) and HYPERBUS™ (JEDEC xSPI Profile 2) interface options. Both offer the maximum x8 performance of 400MBps as specified by the standard.
Product | Flash+RAM MCP Gen 2 | HYPERBUS™ MCP | |
Flash | SEMPER™ NOR Flash | HYPERFLASH™ | |
RAM | HYPERRAM™ 2.0 | HYPERRAM™ 1.0 | |
Series | S78 | S76 | S71 |
Interface | Octal (xSPI Profile 1) |
HYPERBUS™ (xSPI Profile 2) |
HYPERBUS™ |
Family | HS-T (1.8V) HL-T (3.0V) |
KS-S (1.8V) KL-S (3.0V) |
Last Updated: May 06, 2022
Infineon works directly with our partners to ensure our HYPERBUS™ memory solutions are fully compatible with existing and new chipsets. This effort ensures Infineon’s products can be easily paired with chipsets from industry-leading manufacturers while shortening customers’ embedded system design cycles.
Check back regularly to verify the growing list of microcontrollers supporting HYPERBUS™ products.
HYPERBUS™ Chipset Support
Partner | Chipset / Platform Name | Application | HyperFlash | HyperRAM |
Infineon |
TRAVEO™ S6J331x | Automotive Cluster | • | • |
TRAVEO™ S6J335x | Automotive Gateway | • | • | |
TRAVEO™ S6J326Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J324Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J327Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J328Cx | Automotive Cluster | • | • | |
TRAVEO™ S6J32DAx | Automotive Cluster | • | • | |
TRAVEO™ S6J32BAx | Automotive Cluster | • | • | |
TRAVEO™ II CYT4BF | Automotive Body | • | • | |
TRAVEO™ II CYT3BB/4BB | Automotive Body | • | • | |
FM4 Family S6E2DH Series | Industrial | • | • | |
Altera/Intel |
MAX10 | Industrial | • | • |
Cyclone 10 LP | Industrial | • | • | |
Faraday Tech |
A600 | IoT | • | • |
GCT | GDM7243i | IoT | • | • |
Gowin Semiconductor | GW1NSR-2C | FPGA, Industrial | • | • |
Greewaves Technologies | GAP8 | Artificial Intelligence(AI), IoT | • | • |
Lattice Semiconductor | CrossLink-NX | Image Sensor | • | |
Maxim | MAX32650 | Industrial, Portable Medical, IoT | • | • |
Microchip | PolarFire | Industrial, Communications, Defence | • | • |
NXP
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MAC57D5xxx | Automotive Cluster | • | |
S32K148 | Automotive Generic / Body | • | ||
S32V23x | Automotive ADAS | • | ||
Kinetis K80 | Industrial | • | ||
Kinetis K82 | Industrial | • | ||
Kinetis K27F / K28F | Industrial | • | ||
i.MX8 Family | Automotive Infotainment, Industrial, Consumer | • | • | |
i.MX 8ULP | Industrial, Smart Home, HMI |
• | • | |
i.MX RT1050 |
Industrial |
• |
• |
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i.MX RT1020 |
Industrial |
• |
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i.MX RT1060 |
Industrial |
• |
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i.MX RT1064 |
Industrial |
• |
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MCU-Based Solution for Alexa Voice Service |
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Industrial, Consumer |
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Industrial, Medical |
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Automotive Networking, Industrial |
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I.MX RT family |
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Automotive Radar |
• |
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Consumer, Wearable, IoT |
• |
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Renesas
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Automotive Cluster |
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Automotive Infotainment / ADAS |
• |
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Automotive Digital Cockpit, infotainment |
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Automotive Infotainment / ADAS |
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Automotive Gateway, Domain Control |
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Automotive ADAS |
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Automotive ADAS |
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ADAS / Autonomous Driving |
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Automotive ADAS and A.D. |
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Industrial, A.I. |
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Semidrive |
Automotive Cluster and Body |
• |
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ST
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STM32L4Rx |
Industrial |
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Automotive Gateway |
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SPC58EHx / SPC58NHx |
Automotive Body, Network, Security |
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Industrial |
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Industrial |
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Texas Instruments |
Industrial |
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Industrial, Networking |
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Automotive Digital Cockpit |
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ADAS |
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Xilinx
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Communications |
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Communications |
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Communications |
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Communications / Industrial |
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Networking |
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Networking |
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Various |
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Industrial |
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Industrial |
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HYPERBUS™ 3rd Party Development Platform
Partner | 3rd Party Development Platform |
Application | HyperFlash | HyperRAM |
Trenz Electronics |
TE0725 with Xilinx Artix-7 | Industrial | • | • |
TE0748 with Xilinx Artix | Secure SD | • | • | |
Devboards | HyperMAX with Altera MAX10 | Industrial, Medical, Automotive |
HyperBus Memory Controller IP
IP Supplier |
Link |
Can be integrated in FPGA as Soft IP |
Can be integrated in a SoC |
Infineon |
• |
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Cadence |
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Mobiveil |
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Synaptic Laboratories Ltd. |
• |
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Synopsys |
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HyperBus Memory Controller Verification IP
IP Supplier | Link | HyperFlash | HyperRAM |
Cadence | Link for Cadence | • | • |